TFM-115-02-S-D-WT is out of stock and can be placed on backorder.
Available Substitutes:

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Samtec Inc.
In Stock: 0
Unit Price: $33.21000
Datasheet
Connector Header Surface Mount 30 position 0.050" (1.27mm)
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

TFM-115-02-S-D-WT

DigiKey Part Number
SAM8706-ND
Manufacturer
Manufacturer Product Number
TFM-115-02-S-D-WT
Description
CONN HEADER SMD 30POS 1.27MM
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Connector Header Surface Mount 30 position 0.050" (1.27mm)
Datasheet
 Datasheet
EDA/CAD Models
TFM-115-02-S-D-WT Models
Product Attributes
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Category
Fastening Type
Push-Pull
Mfr
Contact Length - Mating
0.131" (3.33mm)
Series
Insulation Height
0.220" (5.60mm)
Packaging
Tube
Contact Shape
Square
Part Status
Active
Contact Finish - Mating
Gold
Connector Type
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Type
Male Pin
Contact Finish - Post
Tin
Pitch - Mating
Contact Material
Phosphor Bronze
Number of Positions
Insulation Material
Liquid Crystal Polymer (LCP)
Number of Rows
2
Features
Solder Retention
Row Spacing - Mating
Operating Temperature
-55°C ~ 125°C
Number of Positions Loaded
All
Material Flammability Rating
UL94 V-0
Style
Insulation Color
Black
Shrouding
Shrouded - 4 Wall
Current Rating (Amps)
3.2A per Contact
Mounting Type
Voltage Rating
250VAC
Termination
Solder
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Substitutes (1)
Part NumberManufacturerQuantity AvailableDigiKey Part NumberUnit PriceSubstitute Type
TFM-115-02-L-D-WTSamtec Inc.0SAM10138-ND$33.21000Similar
In-Stock: 0
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All prices are in HKD
Tube
QuantityUnit PriceExt Price
1$38.43000$38.43
10$36.02800$360.28
25$33.56080$839.02
50$31.37920$1,568.96
100$28.82560$2,882.56
500$26.36110$13,180.55
1,000$24.01022$24,010.22
2,000$23.74760$47,495.20
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.